SCI papers (2019년)
127.· “ Nickel–tin transient liquid phase sintering with high bonding strength for high‑temperature power applications”, Journal of Materials Science: Materials in Electronics, 30(22) (2019.11) 20205-20212 (주저자,교신저자)
Jeong-Won Yoon, Young-Se Kim, So-Eun Jeong
126.· “ Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints”, Journal of Alloys and Compounds, 805 (2019.10) 1013-1024 (교신저자)
Jungsoo Kim, Seung-Boo Jung and Jeong-Won Yoon
125.· “ Effects of Ni layer thickness of thin-ENEPIG surface finishes on interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu solder joints during aging”, Journal of Materials Science: Materials in Electronics, 30 (2019.7) 12911-12923 (교신저자)
Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung and Jeong-Won Yoon
SCI papers (2018년)
124.· “Initial interfacial reactions of Ag/In/Ag and Au/In/Au joints during transient liquid phase bonding”, Microelectronic Engineering, 201 (2018.12) 6-9 (주저자,교신저자)
Jeong-Won Yoon and Byung-Suk Lee
123.· “Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes”, Surface and Interface Analysis, 50(11) (2018.11) 1046-1050 (주저자,교신저자)
Jeong-Won Yoon, Jong-Hoon Back and Seung-Boo Jung
122.· “ Effect of sintering conditions on mechanical strength of Cu-sintered joints for high-power applications”, Materials, 11(11) (2018) 2105 (주저자,교신저자)
Jeong-Won Yoon and Jong-Hoon Back
121.· “Effect of surface finish metallization on mechanical strength of Ag sintered joint”, Microelectronic Engineering, 198 (2018.10) 15-21 (주저자,교신저자)
Jeong-Won Yoon, Jong-Hoon Back and Seung-Boo Jung
120.· “Sequential interfacial reactions of Au/In/Au TLP-bonded joints for power electronics applications”, Thin Solid Films, 660 (2018.8) 618-624 (주저자,교신저자)
Jeong-Won Yoon and Byung-Suk Lee
119.· “Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition”, Metals, 8(8) (2018) 586 (공동저자)
Junghwan Bang, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa and Chang-Woo Lee
118.· “ Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints”, Journal of Materials Science: Materials in Electronics, 29(6) (2018.3) 4724-4731 (주저자,교신저자)
Jeong-Won Yoon, Jong-Hoon Back and Seung-Boo Jung
117.· “Cu-Sn Intermetallic Compound Joints for High-temperature Power Electronics Applications”, Journal of Electronic Materials, 47(1) (2018.1) 430-435 (교신저자)
Byung-Suk Lee and Jeong-Won Yoon
SCI papers (2017년)
116.· “ Die-Attach for Power Devices using the Ag Sintering Process: Interfacial Microstructure and Mechanical Strength”, Metals and Materials International, 23(5) (2017.9) 958-963 (교신저자)
Byung-Suk Lee and Jeong-Won Yoon
115.· “Enhancement of Cu pillar bumps by electroless Ni plating”, Microelectronic Engineering, 180 (2017.8) 52-55 (교신저자)
Byung-Suk Lee, Seung-Boo Jung and Jeong-Won Yoon
114.· “Cu-Sn and Ni-Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging”, Journal of Materials Science: Materials in Electronics, 28(11) (2017.6) 7827-7833 (교신저자)
Byung-Suk Lee, Soong-Keun Hyun and Jeong-Won Yoon
113.· “Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications”, Microelectronics Reliability, 71 (2017.4) 119-125 (교신저자)
Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim and Jeong-Won Yoon
SCI papers (2016년)
112.• “Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints”, Journal of Electronic Materials, 45(12) (2016.12) 6184-6191 (교신저자)
Kyoung-Ho Kim, Junichi Koike, Jeong-Won Yoon, and Sehoon Yoo
111.· “Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications”, Surface and Interface Analysis, 48(7) (2016.7) 493-497 (교신저자)
Byung-Suk Lee, Chang-Woo Lee and Jeong-Won Yoon
110.· “Effect of hygrothermal treatment on reliability of thermo-compression bonded FPCB/RPCB contact joints”, Materials Transactions, 57(5) (2016.5) 716-720 (교신저자)
Jeong-Won Yoon and Seung-Boo Jung
109.· “Board Level Drop Reliability of Epoxy-Containing Sn-58mass% Bi Solder Joints with Various Surface Finishes”, Materials Transactions, 57(3) (2016.3) 466-471 (교신저자)
Sang-Min Lee, Jeong-Won Yoon and Seung-Boo Jung
108.· “Electromigration effect on Sn-58%Bi solder joints with various substrate metallizations under current stress”, Journal of Materials Science: Materials in Electronics, 27(2) (2016.2) 1105-1112 (교신저자)
Sang-Min Lee, Jeong-Won Yoon and Seung-Boo Jung
SCI papers (2015년)
107.· “Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints”, Journal of Alloys and Compounds, 627 (2015.4) 276-280 (교신저자)
Jeong-Won Yoon, Jung-Hwan Bang, Chang-Woo Lee and Seung-Boo Jung
106.· “Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions”, Journal of Materials Science: Materials in Electronics, 26(3) (2015.3) 1649-1660 (교신저자)
Sang-Min Lee, Jeong-Won Yoon and Seung-Boo Jung
SCI papers (2014년)
105.· “Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate”, Metals and Materials International, 20(3) (2014.5) 515-519 (교신저자)
Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung
104.· “Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions”, Microelectronics Reliability, 54(2) (2014.2) 410-416 (교신저자)
Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung
SCI papers (2013년)
103.· “Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test”, Microelectronics Reliability, 53(12) (2013.12) 2036-2042 (교신저자)
Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, and Seung-Boo Jung
102.· “Effects of Atmospheric Pressure Plasma Surface Treatments on the Patternability and Electrical Property of Screen-Printed Ag Nanopaste”, Metals and Materials International, 19(4) (2013.07) 829-834
Young-Chul Lee, Jong-Woong Kim, Jeong-Won Yoon, Cheol-Woong Yang, Yongil Kim and Seung-Boo Jung
101.· “Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder”, Microelectronic Engineering, 103 (2013.3) 1-6
Bo-In Noh, Jeong-Won Yoon, Kwang-Seok Kim, Sayoon Kang and Seung-Boo Jung
SCI papers (2012년)
100.· “Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test”, Journal of Materials Science: Materials in Electronics, 23(8) (2012.8) 1515-1520
Ilje Cho, Jee-Hyuk Ahn, Jeong-Won Yoon, Young-Eui Shin, and Seung-Boo Jung
99.· “Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders”, Journal of Materials Science: Materials in Electronics, 23(1) (2012.1) 41-47 (교신저자)
Jeong-Won Yoon, Jong-Gun Lee, Jong-Bum Lee, Bo-In Noh, and Seung-Boo Jung
SCI papers (2011년)
98.· “Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint”, Journal of Materials Science: Materials in Electronics, 22(9) (2011.9) 1308-1312
Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang
97.· “Comparative study of ENIG and ENEPIG as surface finishes for a Sn-Ag-Cu solder joint”, Journal of Electronic Materials, 40(9) (2011.9) 1950-1955 (교신저자)
Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung
96.· “Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold surface finish”, Journal of Electronic Materials, 40(9) (2011.9) 1937-1942
Q.V. Bui, N.D. Nam, J. W. Yoon, D.H. Choi, A. Kar, J.G. Kim, S.B. Jung
95.· “Effect of Sintering Temperature on Electrical Characteristics of Screen-Printed Ag Nanopaste on FR4 Substrate”, Journal of Nanoscience and Nanotechnology, 11(7) (2011.7) 5915-5920
Young-Chul Lee, Jee-Hyuk Ahn, Kwang-Seok Kim, Jeong-Won Yoon, Jong-Woong Kim, Yongil Kim, and Seung-Boo Jung
94.· “Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits”, Journal of Materials Science: Materials in Electronics, 22(7) (2011.7) 790-796
Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee and Seung-Boo Jung
93.· “Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu”, Journal of Materials Science: Materials in Electronics, 22(7) (2011.7) 745-750 (교신저자)
Jeong-Won Yoon, Bo-In Noh, Jung-Hyun Choi and Seung-Boo Jung
92.· “Fabrication and adhesion strength of Cu/Ni-Cr/polyimide films for flexible printed circuits”, Microelectronic Engineering, 88(6) (2011.6) 1024-1027
Bo-In Noh, Jeong-Won Yoon, and Seung-Boo Jung
91.· “Effect of Thermal Treatment on Adhesion Strength of Cu/Ni-Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process”, Microelectronic Engineering, 88(5) (2011.5) 718-723
Bo-In Noh, Jeong-Won Yoon, Jung-Hyun Choi and Seung-Boo Jung
90.· “Influence of current density on mechanical reliability of Sn-3.5Ag BGA solder joint”, Microelectronic Engineering, 88(5) (2011.5) 709-714
Sang-Su Ha, Ji-Yoon Sung, Jeong-Won Yoon and Seung-Boo Jung
89.· “In-situ TEM characterization of interfacial reaction in Sn-3.5Ag/electroless Ni(P) solder joint”, Scripta Materialia, 64(7) (2011.4) 597-600
Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang
88.· “Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during reflow process”, Journal of Alloys and Compounds, 509 (2011.3) L153-L156 (교신저자)
Jeong-Won Yoon, Bo-In Noh, Jae-Hyun Yoon, Han-Byul Kang and Seung-Boo Jung
87.· “Effects of different kinds of underfills and temperature humidity treatments on drop reliability of board level packages”, Journal of Electronic Materials, 40(2) (2011.2) 224-231
Bo-In Noh, Jeong-Won Yoon, Sang-Ok Ha, and Seung-Boo Jung
86.· “Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar”, Journal of Materials Science: Materials in Electronics, 22(1) (2011.1) 84-90 (교신저자)
Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung
85.· “Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern”, Journal of Electronic Materials, 40(1) (2011.1) 35-41
Bo-In Noh, Jeong-Won Yoon, Kwang-Seok Kim, Young-Chul Lee and Seung-Boo Jung