SCI papers (2010년)
84.· “Characterization of ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/electroless Ni (P) solder joint”, Scripta Materialia, 63 (2010.11) 1108-1111
Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang
83.· “Effect of Ni-Cr Seed Layer Thickness on the Adhesion Characteristics of Flexible Copper Clad Laminates Fabricated by a Roll-to-Roll Process”, Metals and Materials International, 16(5) (2010.10) 779-784
Bo-In Noh, Jeong-Won Yoon, and Seung-Boo Jung
82.· “Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints”, Journal of Alloys and Compounds, 506 (2010.9) 331-337
Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung
81.· “Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys”, Journal of Alloys and Compounds, 499 (2010.6) 154-159
Bo-In Noh, Jung-Hyun Choi, Jeong-Won Yoon and Seung-Boo Jung
80.· “Mechanical reliability of Sn-Ag BGA solder joints with various electroless Ni-P and Ni-B plating layers”, IEEE Transactions on Components and Packaging Technologies, 33(1) (2010.3) 222-228
Jeong-Won Yoon, Bo-In Noh, and Seung-Boo Jung
79.· “Comparison of interfacial stability of Pb-free solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu and Sn-0.7Cu) on ENIG-plated Cu during aging”, IEEE Transactions on Components and Packaging Technologies, 33(1) (2010.3) 64-70
Jeong-Won Yoon, Bo-In Noh, and Seung-Boo Jung
78.· “Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package”, Microelectronic Engineering, 87(3) (2010.3) 517-521
Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jeong-Won Yoon, Hoo-Jeong Lee, Jin-Ho Joo, Young-Ho Kim and Seung-Boo Jung
77.· “Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process”, Materials Transactions, 51(1) (2010.1) 85-89
Bo-In Noh, Jeong-Won Yoon, Jung-Hyun Choi and Seung-Boo Jung
76.· “Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer”, International Journal of Adhesion and Adhesives, 30(1) (2010.1) 30-35
Bo-In Noh, Jeong-Won Yoon, and Seung-Boo Jung
SCI papers (2009년)
75.· “Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joint using High-Speed Ball Shear Test”, Journal of Electronic Materials, 38(12) (2009.12) 2489-2495
Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jong-Woong Kim, Jeong-Won Yoon, Byung-Woo Kim, Sun-Kyu Park and Seung-Boo Jung
74.· “Interfacial reaction and mechanical reliability of eutectic Sn-0.7Cu/immersion Ag-plated Cu solder joint”, Materials Science and Technology, 25(12) (2009.12) 1478-1484
Jeong-Won Yoon and Seung-Boo Jung
73.· “Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints”, Journal of Alloys and Compounds, 486(1-2) (2009.11) 142-147
Jeong-Won Yoon, Bo-In Noh, Bong-Kyun Kim, Chang-Chae Shur and Seung-Boo Jung
72.· “Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package”, IEEE Transactions on Components and Packaging Technologies, 32(3) (2009.9) 633-638
Bo-In Noh, Jeong-Won Yoon, and Seung-Boo Jung
71.· “Adhesion characteristics of Cu/Ni-Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness”, Journal of Materials Science: Materials in Electronics, 20(9) (2009.9) 885-890
Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee and Seung-Boo Jung
70.· “Reliability of Au bump flip chip packages with adhesive materials using four-point bending test”, International Journal of Adhesion and Adhesives, 29(6) (2009.9) 650-655
Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong and Seung-Boo Jung
69.· “Solder Joint Reliability in Flip Chip Package with Surface Treatment of ENIG under Thermal Shock Test”, Metals and Materials International, 15(4) (2009.8) 655-660
Sang-Su Ha, Sang-Ok Ha, Jeong-Won Yoon, Jong-Woong Kim, Min-Kwan Ko, Dae-Gon Kim, Sung-Jin Kim, Tae-Hwan Hong and Seung-Boo Jung
68.· “Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes”, Journal of Electronic Materials, 38(6) (2009.6) 902-907
Bo-In Noh, Jeong-Won Yoon, Won-Sik Hong and Seung-Boo Jung
67.· “Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint”, Journal of Alloys and Compounds, 469 (2009.2) 108-115
Jeong-Won Yoon, Hyun-Suk Chun and Seung-Boo Jung
66.· “Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints”, Scripta Materialia, 60(4) (2009.2) 257-260
Han-Byul Kang, Jee-Hwan Bae, Jae-Wook Lee, Min-Ho Park, Young-Chul Lee, Jeong-Won Yoon, Seung-Boo Jung, Cheol-Woong Yang
65.· “Electromigration behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu flip chip solder joints under high current density”, Journal of Electronic Materials, 38(1) (2009.1) 70-77
Sang-Su Ha, Jong-Woong Kim, Jeong-Won Yoon, Sang-Ok Ha, and Seung-Boo Jung
SCI papers (2008년)
64.· “Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint”, Microelectronics Reliability, 48(11-12) (2008.11) 1864-1874
Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee and Seung-Boo Jung
63.· “Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method”, Microelectronics Reliability, 48(11-12) (2008.11) 1857-1863
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, and Seung-Boo Jung
62· “Mechanical Reliability Evaluation of Sn-37Pb Solder Joint Using High Speed Lap-shear Test”, Microelectronic Engineering, 85(10) (2008.10) 1967-1970
Seong-Jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung, Hoo-Jeong Lee
61.· “Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder”, Journal of Alloys and Compounds, 466(1-2) (2008.10) 73-79
Jeong-Won Yoon, Ja-Myeong Koo, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Chang-Yong Lee, Jong-Hyun Park, Chang-Chae Shur, Seung-Boo Jung
60.· “Thermal degradation of anisotropic conductive film joints under temperature fluctuation”, International Journal of Adhesion and Adhesives, 28(6) (2008.9) 314-320
Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park and Seung-Boo Jung
59.· “Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system”, Journal of Materials Research, 23(8) (2008.8) 2195-2201
Han-Byul Kang, Jae-Wook Lee, Jee-Hwan Bae, Min-Ho Park, Jeong-Won Yoon, Seung-Boo Jung, Jae-Seon Ju and Cheol-Woong Yang
58.· “Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows”, Journal of Materials Research, 23(6) (2008.6) 1631-1641
Ja-Myeong Koo, Jeong-Won Yoon and Seung-Boo Jung
57.· “Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn3.5Ag0.7Cu solder joint”, Journal of Alloys and Compounds, 458(1-2) (2008.6) 200-207
Jeong-Won Yoon and Seung-Boo Jung
56.· “Correlation between Interfacial Reactions and Shear Strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu Solder Joints”, Materials Science & Engineering A, 483-484 (2008.6) 731-734
Jeong-Won Yoon, Hyun-Suk Chun and Seung-Boo Jung
55.· “Effect of Displacement Rate on Bump Shear Properties of Electroplated Solder Bumps in Flip Chip Package”, Materials Science & Engineering A, 483-484 (2008.6) 620-624
Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon and Seung-Boo Jung
54.· “Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au”, Materials Science & Engineering A, 473(1-2) (2008.1) 119-125
Jeong-Won Yoon, Hyun-Suk Chun and Seung-Boo Jung
53.· “Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates”, Journal of Electronic Materials, 37(1) (2008.1) 84-89
Han-Byul Kang, Jee-Hwan Bae, Jae-Wook Lee, Min-Ho Park, Jeong-Won Yoon, Seung-Boo Jung and Cheol-Woong Yang
52.· “Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu(ENIG) sandwich solder joints”, Journal of Alloys and Compounds, 448(1-2) (2008.1) 177-184
Jeong-Won Yoon and Seung-Boo Jung
SCI papers (2007년)
51.· “Fabrication of Ni Metal Mask with Fine Pitch by Electroforming Process”, Journal of Electronic Materials, 36(11) (2007.11) 1510-1515
Jun Hyung Lim, Eui Cheol Park, Seung-Yi Lee, Jeong-Won Yoon, Sang-Su Ha, Jinho Joo, Hoo-Jeong Lee, Seung-Boo Jung and Keun Song
50.· “Reliability of Nickel Flip Chip Bump with Tin-Silver Encapsulation on Copper/Tin-Silver Substrate during Bonding Process”, Microelectronic Engineering, 84(11) (2007.11) 2686-2690
Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Sang-Su Ha and Seung-Boo Jung
49.· “Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method”, Microelectronic Engineering, 84(11) (2007.11) 2640-2645
Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon and Seung-Boo Jung
48.· “Investigation of interfacial reaction between Au-Sn solder and Kovar for hermetic sealing application”, Microelectronic Engineering, 84(11) (2007.11) 2634-2639
Jeong-Won Yoon and Seung-Boo Jung
47.· “Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus contents”, Microelectronic Engineering, 84(11) (2007.11) 2552-2557
Jeong-Won Yoon, Jong-Hyun Park, Chang-Chae Shur and Seung-Boo Jung
46.· “Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging”, Journal of Materials Research, 22(10) (2007.10) 2817-2824
Jeong-Won Yoon, Hyun-Suk Chun, Hoo-Jeong Lee and Seung-Boo Jung
45.· “Morphology, thermal stability and solderability of electroless nickel-phosphorus plating layer”, Surface Review and Letters, 14(4) (2007.8) 827-832
Jeong-Won Yoon, Hyun-Suk Chun, Han-Byul Kang, Min-Ho Park, Cheol-Woong Yang, Hoo-Jeong Lee and Seung-Boo Jung
44.· “Au-Sn Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications”, Microsystem Technologies, 13(11-12) (2007.7) 1463-1469
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo and Seung-Boo Jung
43.· “Solid-state interfacial reactions between Sn-3.5Ag-0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test”, Journal of Alloys and Compounds, 439(1-2) (2007.7) 91-96
Hyun-Suk Chun, Jeong-Won Yoon and Seung-Boo Jung
42.· “Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating”, Journal of Materials Research, 22(5) (2007.5) 1219-1229
Jeong-Won Yoon, Hyun-Suk Chun and Seung-Boo Jung
41.· “Characterization of failure behaviors in anisotropic conductive interconnection”, Materials Transactions, 48 (5) (2007.5) 1070-1078
Jong-Woong Kim, Dae-Gon Kim, Ja-Myeong Koo, Jeong-Won Yoon, Sunglak Choi, Kyung-Sik Kim, Jae-Do Nam, Hoo-Jeong Lee, Jinho Joo and Seung-Boo Jung
40.· “Investigation of interfacial reactions between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during aging at high temperature”, Journal of Materials Science: Materials in Electronics, 18(5) (2007.5) 559-567
Jeong-Won Yoon, Hyun-Suk Chun and Seung-Boo Jung
39.· “Effect of High Temperature Storage Test on Reliability of Eutectic Sn-Cu/ENIG Solder Joint”, Materials Science and Technology, 23(4) (2007.4) 411-416
Jeong-Won Yoon, Sang-Won Kim and Seung-Boo Jung
38.· “Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging”, Materials Science & Engineering A, 452-453C (2007.4) 46-54
Jeong-Won Yoon and Seung-Boo Jung
37.· “Microstructural evolution of Sn-rich Au-Sn/Ni flip chip solder joints under high temperature storage testing condition”, Scripta Materialia, 56(8) (2007.4) 661-664
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Hoo-Jeong Lee and Seung-Boo Jung
SCI papers (2006년)
36.· “Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150℃”, Journal of Materials Research, 21(12) (2006.12) 3196-3204
Jeong-Won Yoon, Jun Hyung Lim, Won-Chul Moon, Hoo-Jeong Lee, Jinho Joo and Seung-Boo Jung
35.· “Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging”, Microelectronic Engineering, 83(11-12) (2006.11) 2329-2334
Jeong-Won Yoon and Seung-Boo Jung
34.· “Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint During Aging”, Advanced Materials Research, 15-17 (2006) 1001-1006
Jeong-Won Yoon and Seung-Boo Jung
33.· “Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder”, Journal of Materials Research, 21 (2006.6) 1590-1599
Jeong-Won Yoon and Seung-Boo Jung
32.· “Effects of reflow and cooling conditions on Interfacial Reaction and IMC morphology of Sn-Cu/Ni solder joint”, Journal of Alloys and Compounds, 415(1-2) (2006.5) 56-61
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
31.· “High Temperature Reliability and Interfacial Reaction of Eutectic Sn-0.7Cu/Ni Solder Joints during Isothermal Aging”, Microelectronics Reliability, 46(5-6) (2006.5) 905-914
Jeong-Won Yoon and Seung-Boo Jung
30.· “Characteristic Analysis of Electroless Ni Plating layer for Electronic Packaging”, Surface and Interface Analysis, 38 (2006.4) 440-443
Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Won-Bae-Lee and Seung-Boo Jung
29.· “Interfacial Reactions between In-48Sn Solder and Electroless Nickel/Immersion Gold Substrate during Reflow Process”, Surface and Interface Analysis, 38 (2006.4) 426-428
Ja-Myeong Koo, Jeong-Won Yoon and Seung-Boo Jung
28.· “Effect of Isothermal Aging on the Interfacial Reactions between Sn-0.4Cu Solder and Cu Substrate with or without ENIG Plating Layer”, Surface and Coatings Technology, 200 (2006.4) 4440-4447
Jeong-Won Yoon and Seung-Boo Jung
27.· “TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate”, Materials Science Forum, 510-511 (2006.3) 554-557
Jeong-Won Yoon and Seung-Boo Jung
26.· “Reliability Studies of Sn-9Zn/Cu Solder Joints with Aging Treatment”, Journal of Alloys and Compounds, 407 (2006.1) 141-149
Jeong-Won Yoon, Seung-Boo Jung
SCI papers (2005년)
25.· “Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni BGA joint with reflow time”, Zeitschrift fur Metallkunde, 96 (12) (2005.12) 1420-1425
Jeong-Won Yoon and Seung-Boo Jung
24.· “Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate”, Microelectronic Engineering, 82/3-4 (2005.12) 561-568Chang-Yong Lee, Jeong-Won Yoon, Young-Jig Kim, Seung-Boo Jung
23.· “Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging”, Materials Transactions, 46 (11) (2005.11) 2386-2393
Jeong-Won Yoon, Hyun-Suk Chun and Seung-Boo Jung
22.· “Interfacial Reactions between Sn-0.4Cu Solder and Cu Substrate with or without ENIG Plating Layer during Reflow Reaction”, Journal of Alloys and Compounds, 396 (2005.6) 122-127
Jeong-Won Yoon and Seung-Boo Jung
21.· “IMC morphology, Interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate”, Journal of Alloys and Compounds, 392 (2005.4) 247-252
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
20.· “Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow”, Materials Science Forum, 486-487 (2005) 289-292
Jeong-Won Yoon, Sang-Won Kim and Seung-Boo Jung
19.· “Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging”, Journal of Alloys and Compounds, 391 (2005.4) 82-89
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
SCI papers (2004년)
18.· “Effect of Reflow Time on Interfacial Reaction and Shear Strength of Sn-0.7Cu solder/Cu and electroless Ni-P BGA Joints”, Journal of Alloys and Compounds, 385 (2004.12) 192-198
Jeong-Won Yoon, Sang-Won Kim and Seung-Boo Jung
17.· “Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate”, Journal of Alloys and Compounds, 381 (2004.11) 151-157
Jeong-Won Yoon, Young-Ho Lee, Dae-Gon Kim, Han-Byul Kang, Su-Jeong Suh, Cheol-Woong Yang, Chang-Bae Lee, Jong-Man Jung, Choong-Sik Yoo, and Seung-Boo Jung
16.· “Interfacial Reactions and Shear Strengths between Sn-Ag based Pb-Free Solder Balls and Au/EN/Cu Metallization”, Journal of Electronic Materials, 33 (10) (2004.10) 1182-1189
Sang-Won Kim, Jeong-Won Yoon and Seung-Boo Jung
15.· “Reliability Investigation and Interfacial Reaction on Lead-Free Sn-Cu/Ni BGA Package”, Journal of Electronic Materials, 33 (10) (2004.10) 1190-1199
Jeong-Won Yoon, Sang-Won Kim, Ja-Myeong Koo, Dae-Gon Kim and Seung-Boo Jung
14.· “Phase analysis and kinetics of solid-state aging of Pb-free Sn-3.5Ag solder on electroless Ni-P substrate”, Surface and Interface Analysis, 36 (2004.8) 963-965
Jeong-Won Yoon and Seung-Boo Jung
13.· “Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate”, Journal of Alloys and Compounds, 376 (2004.8) 105-110
Jeong-Won Yoon and Seung-Boo Jung
12.· “Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate”, Journal of Materials Science, 39 (2004.7) 4211-4217
Jeong-Won Yoon and Seung-Boo Jung
11.· “IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging”, Materials Transactions, 45 (3) (2004.3) 727-733
Jeong-Won Yoon, Sang-Won Kim and Seung-Boo Jung
10.· “Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints”, Materials Science Forum, 449-452 (2004) 897-900
Jong-Woong Kim, Jeong-Won Yoon and Seung-Boo Jung
9.· “Growth kinetics of IMC formed between Sn-3.5Ag-0.75Cu BGA solder and electroless Ni-P/Cu substrate by solid-state isothermal aging”, Materials Science Forum, 449-452 (2004) 893-896
Jeong-Won Yoon, Chang-Bae Lee and Seung-Boo Jung
SCI papers (2003년)
8.· “Growth of an Intermetallic Compound Layer with Sn-3.5Ag-5Bi solder on Cu and Ni-P/Cu during Aging Treatment”, Journal of Electronic Materials, 32 (11) (2003.11) 1195-1202
Jeong-Won Yoon, Chang-Bae Lee and Seung-Boo Jung
7.· “Investigation of interfacial reactions between Sn-5Bi solder and Cu Substrate”, Journal of Alloys and Compounds, 359 (2003.9) 202-208
Jeong-Won Yoon and Seung-Boo Jung
6.· “Activation Energies of Intermetallic Compound Growth at the Interface Between Sn-5Bi-3.5Ag solder and Cu substrate”, Materials Science and Technology, 19 (2003.8) 1101-1106
Jeong-Won Yoon, Chang-Bae Lee and Seung-Boo Jung
5.· “Intermetallic Compound Layer Formation Between Sn-3.5 mass%Ag BGA Solder Ball and (Cu, Immersion Au/electroless Ni-P/Cu) Substrate”, Journal of Materials Science-Materials in Electronics, 14(8) (2003.8) 487-493
Chang-Bae Lee, Jeong-Won Yoon, Su-Jeong Suh, Cheol-Woong Yang, Chang-Chae Shur, young-Eui Shin and Seung-Boo Jung
4.· “Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, Electroless Ni-P/Cu) Substrate”, Zeitschrift fur Metallkunde, 94 (4) (2003.4) 453-457
Jeong-Won Yoon, Chang-Yong Lee, Chang-Bae Lee, Choong-Sik Yoo and Seung-Boo Jung
Highly Cited Papers (top 1% per research field) Thomson
3.· “Reaction diffusions of Cu6Sn5 and Cu3Sn Intermetallic Compound in the couple of Sn-3.5Ag Eutectic Solder and Copper Substrate”, Metals and Materials International, 9 (2) (2003.4) 193-199
Jeong-Won Yoon, Chang-Bae Lee, Dae-Up Kim and Seung-Boo Jung
2.· “Reaction Diffusion and Formation of Cu11In9 and In27Ni10 Phases in the Couple of Indium-Substrates”, Materials Transactions, 44 (1) (2003.1) 72-77
Dae-Gon Kim, Jeong-Won Yoon, Chang-Youl Lee and Seung-Boo Jung
SCI papers (2002년)
1.· “Interfacial Reaction Between Sn-58Bi Eutectic Solder and (Cu, electroless Ni-P/Cu) substrate”, Materials Transactions, 43 (8) (2002.8) 1821-1826
Jeong-Won Yoon, Chang-Bae Lee and Seung-Boo Jung