Submitted for Publication
· Soldering characteristics of active metal brazing ceramic substrates with various surface finishes, (교신저자)
Eun-Su Jang, Jee-Yeon Park, Eun-Chae Noh, Chul-Min Oh and Jeong-Won Yoon
· Fracture of Ag Sintering bonding interface on Active Metal Brazing Substrates for Power Electronics,
Jeeyeon Park, Jeong-Won Yoon, Semin Park, Jihyung Lee, Hyojin Park, Chul-Min Oh
· Novel surface finish with nanometer-thick Al2O3 layers via atomic layer deposition process: Properties of solder joint for advanced semiconductor packaging, (교신저자)
Eun-Chae Noh, Min Jeong Kim, Seyoung Oh, Byungjin Cho, Jeong-Won Yoon
· Comparative Evaluation of Long-term High-temperature Reliability of Terminal Joints for EV Power Modules Based on Substrate Surface Finishes and Bonding Methods, (교신저자)
Dong-Bok Lee, Kwan-Soo Lim, Hyojin Park, Ji-Hyung Lee, Semin Park, Chul-Min Oh and Jeong-Won Yoon
· Hierarchically Engineered Self-Healing Microfiber Pressure Sensor with Graphene-Mediated Electroless Copper Deposition, (교신저자)
ByungJun Kim, Su Bin Choi, Yeonwook Jeong, Jeong-Won Yoon, Seung-Boo Jung, Jong-Woong Kim
· Bonding characteristics of Cu–Cu joints with an Au passivation layer bonded at low temperatures for advanced packaging, (교신저자)
Song-Yeon Baek, Eun-Chae Noh, and Jeong-Won Yoon
· Effects of electrodeposited Cu microstructure on interfacial reactions and joint integrity in Sn3.0Ag0.5Cu–Cu solder joints, (교신저자)
Da-Gyeong Han, Jeongho Lee, Myung Jun Kim, and Jeong-Won Yoon
· Bonding and Mechanical Properties of Sn58Bi/Sn3.0Ag0.5Cu Hybrid Solder Joints with TiC Nanoparticle Additions, (교신저자)
Kwan-Soo Lim and Jeong-Won Yoon
· Effects of MoS2 content on the microstructures and mechanical properties of low melting temperature Sn–Bi solder joints, (교신저자)
Hyeon-Tae Kim and Jeong-Won Yoon
· Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging, (교신저자)
Taejoon Noh, Eun-Chae Noh, Minjae Sung, Jaejun Yoon, Ho-Kyeong Seong, Dong-gil Kang, Jeong-Won Yoon and Seung-Boo Jung
2025
168.· Sn-3.0Ag-0.5Cu/OSP Solder Joints Assembled using Multi-Wavelength Light, Materials Today Communications, 47 (2025.7) 113279 (교신저자)
Hyo-Won Lee, Eun-Chae Noh, Jong-Woong Kim, Seung-Boo Jung, Jeong-Won Yoon
167.· A novel strategy for uniform growth of intermetallic compounds in solder joint by suppressing grain-boundary diffusion in copper foil, Journal of Materials Research and Technology, 36 (2025.5-6) 8277–8283
Doo Won Kim, Jun Sang Park, Sang Jin Lee, Jeong-Won Yoon, Yun-Soo Lee, Jee Hyuk Ahn
166.· Deep learning-developed multi-light source discrimination capability of stretchable capacitive photodetector, npj Flexible Electronics, 9 (2025.5) 44 (교신저자)
Su Bin Choi, Jun Sang Choi, Hyun Sik Shin, Jeong-Won Yoon, Youngmin, Kim, Jong-Woong Kim
165.· Comparison of pressure-less Ag sinter-bonding properties with varying substrate surface finishes and Ag particle shapes and sizes: Influence of necking region and fracture behavior, Journal of Materials Research and Technology, 36 (2025.5-6) 1314-1323 (교신저자)
Dong-Bok Lee, Jee-Yeon Park, Eun-Chae Noh, Chul-Min Oh and Jeong-Won Yoon
164.· Transient Liquid-Phase Bonding using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging, Journal of Electronic Materials, 54 (2025.3) 1592-1601 (교신저자)
Dong-Bok Lee, Young-Jin Seo and Jeong-Won Yoon
163.· Metallurgical and mechanical properties of transient liquid phase bonded joints formed using Sn/Ni-foam hybrid preforms, Materials Chemistry and Physics, 333 (2025.3) 130340 (교신저자)
Young-Jin Seo and Jeong-Won Yoon
162.· Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging, Materials Today Communications, 43 (2025.2) 111737 (교신저자)
Eun-Chae Noh, Byung-Suk Lee, Yong-Ho Ko and Jeong-Won Yoon
161.· Metallurgical reactions and high-temperature long-term reliability of the Sn-2.3Ag flip-chip solder bump, Microelectronic Engineering, 296 (2025.1) 112293 (교신저자)
Eun-Su Jang and Jeong-Won Yoon
160.· Effects of the grain size and orientation of Cu on the formation and growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints, Journal of Alloys and Compounds, 1010 (2025.1) 177801 (교신저자)
Da-Gyeong Han and Jeong-Won Yoon
2024
159.· Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering, Journal of Materials Research and Technology, 33 (2024.11-12) 6622–6632 (교신저자)
Eun-Chae Noh, Hyo-Won Lee, Jong-Woong Kim, Seung-Boo Jung and Jeong-Won Yoon
158.· Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability, Materials Characterization, 216 (2024.10) 114289 (교신저자)
Seahwan Kim, Kyung Deuk Min, Jeong-Won Yoon and Seung-Boo Jung
157.· Impact of Bonding Methods and Surface Finishes on Terminal-Substrate Reliability in EV Power Modules, Journal of Materials Science: Materials in Electronics, 35 (2024.8) 1601 (교신저자)
Hyeon-Tae Kim, Dong-Bok Lee, Kwan-Soo Lim, Ji-Hyung Lee, Semin Park, Chul-Min Oh and Jeong-Won Yoon
156.· Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints, Materials Today Communications, 40 (2024.8) 109860 (교신저자)
Hyeon-Tae Kim and Jeong-Won Yoon
155.· Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform, Journal of Materials Science: Materials in Electronics, 35 (2024.7) 1339 (교신저자)
Min-Haeng Heo, Young-Jin Seo and Jeong-Won Yoon
2023
154.· Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints, Journal of Materials Science: Materials in Electronics, 34(33) (2023.11) 2176 (교신저자)
Eun-Chae Noh, Young-Jin Seo and Jeong-Won Yoon
153.· Transient liquid phase bonding using Cu foam and Cu–Sn paste for high temperature applications, Journal of Materials Research and Technology, 27 (2023.11-12) 2856-2867 (교신저자)
Min-Haeng Heo, Young-Jin Seo and Jeong-Won Yoon
152.· Microstructures and mechanical properties of ultrasonic-welded Cu–Cu joints for power module terminals in electric vehicles, Journal of Materials Science: Materials in Electronics, 34(29) (2023.10) 1997 (교신저자)
Hyeon-Tae Kim and Jeong-Won Yoon
151.· A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints, Journal of Materials Science: Materials in Electronics, 34(28) (2023.10) 1960 (교신저자)
Min-Seong Jeong, Min-Haeng Heo, Jungsoo Kim and Jeong-Won Yoon
150. Comparative study of solder size and volume effect on properties of Sn-3.0Ag-0.5Cu joints during isothermal aging, Journal of Materials Science: Materials in Electronics, 34(16) (2023.6) 1318 (교신저자)
Young-Jin Seo, Min-Haeng Heo, Eun-Chae Noh and Jeong-Won Yoon
149. Novel and fast transient liquid phase bonding using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform, Materials Today Communications, 35 (2023.6) 105730 (교신저자)
Min-Haeng Heo, Young-Jin Seo and Jeong-Won Yoon
148. Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding, Journal of Materials Research and Technology, 35 (2023.5-6) 4468 (교신저자)
Hyeon-Tae Kim and Jeong-Won Yoon
147. Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin-Au/Pd/Ni(P) substrate, Journal of Materials Science: Materials in Electronics, 34(3) (2023.1) 157 (교신저자)
Dong-Hwan Lee, Min-Seong Jeong and Jeong-Won Yoon
2022
146. Reliability of laser soldering using low melting temperature eutectic Sn-Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad, Materials Characterization, 194 (2022.12) 112397 (교신저자)
Min-Seong Jeong, Dong-Hwan Lee, Hyeon-Tae Kim and Jeong-Won Yoon
145. Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints, Journal of Materials Science: Materials in Electronics, 33(20) (2022.7) 16700-16709 (교신저자)
Young-Jin Seo and Jeong-Won Yoon
144. Effects of shear test temperatures and conditions on mechanical properties of Sn-Ag flip-chip bump, Journal of Materials Science: Materials in Electronics, 33(13) (2022.5) 1002-10012 (교신저자)
Min-Haeng Heo, Dong-Hwan Lee, Min-Seong Jeong and Jeong-Won Yoon
143. Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints, Journal of Alloys and Compounds, 903 (2022.5) 163987 (교신저자)
Min-Seong Jeong, Dong-Hwan Lee and Jeong-Won Yoon
142. Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn-Ag-Cu/Cu joints, Journal of Materials Science: Materials in Electronics, 33(10) (2022.4) 7983-7994 (교신저자)
Dong-Hwan Lee, Min-Seong Jeong and Jeong-Won Yoon
141. Intermetallic compound transformation and mechanical strength of Ni-Sn transient liquid phase sinter-bonded joints in an extreme high-temperature environment, Journal of Materials Science: Materials in Electronics, 33(9) (2022.3) 6616-6626 (교신저자)
So-Eun Jeong and Jeong-Won Yoon
140. Metallurgically and mechanically reliable microsilver sintered joints for automotive power module applications, Journal of Materials Science: Materials in Electronics, 33(3) (2022.1) 1724-1737 (교신저자)
Jeong-Won Yoon and Jong-Hoon Back
139. High-temperature stability of Ni-Sn intermetallic joints for power device packaging, Journal of Alloys and Compounds, 890 (2022.1) 161778 (교신저자)
So-Eun Jeong, Seung-Boo Jung and Jeong-Won Yoon
2021
138. Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn-3.0Ag-0.5Cu solder joints under isothermal aging, Journal of Materials Science: Materials in Electronics, 32(20) (2021.10) 24790-24800 (교신저자)
Jong-Hoon Back and Jeong-Won Yoon
137. Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing, Journal of Alloys and Compounds, 850 (2021.1) 156729 (교신저자)
Jungsoo Kim, Seung-Boo Jung and Jeong-Won Yoon
2020
136. Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn-58Bi solder joints during aging, Journal of Materials Science: Materials in Electronics, 31(22) (2020.11) 19852-19874 (교신저자)
Jungsoo Kim, Seung-Boo Jung and Jeong-Won Yoon
135. Fast formation of Ni-Sn intermetallic joints using Ni-Sn paste for high-temperature bonding applications, Journal of Materials Science: Materials in Electronics, 31(18) (2020.9) 15048-15060 (교신저자)
So-Eun Jeong, Seung-Boo Jung and Jeong-Won Yoon
134. Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications, Applied Surface Science, 515 (2020.6) 146060 (교신저자)
Jeong-Won Yoon, Soyoung Bae, Byung-Suk Lee and Seung-Boo Jung
133. Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint, Journal of Alloys and Compounds, 820 (2020.4) 153396 (교신저자)
Jungsoo Kim, Seung-Boo Jung and Jeong-Won Yoon
132. Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications, Thin Solid Films, 698 (2020.3) 137873 (교신저자)
So-Eun Jeong, Seung-Boo Jung and Jeong-Won Yoon
131. Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin‑Au/Pd/Ni(P) surface‑finished PCBs during aging, Journal of Materials Science: Materials in Electronics, 31(5) (2020.3) 4027-4039 (교신저자)
Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung and Jeong-Won Yoon
130. Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints, Applied Surface Science, 503 (2020.2) 144339 (교신저자)
Jungsoo Kim, Seung-Boo Jung and Jeong-Won Yoon