- u-bump bonding
- Solder joints with ALD layer
- IPL soldering
노은채
박사과정
- Soldering properties with different substrates
- Substrate grain size efffect
- TLP/TLPS bonding
한다경
석사과정 (학석사연계)
- Laser soldering
- Reflow soldering
- Surface finish effect
이효원
석사과정 (학석사연계)
- Flip-chip package
- u-bump
- IPL soldering
- EM test
장은수
석사과정 (학석사연계)
- TLP/TLPS bonding
- Bonding materials for EV packaging
- Ultrasonic bonding
이동복
석사과정 (학석사연계)
- Hybrid Cu bonding & M-to-M direct bonding
- Electronic packaging
- Packaging materials
백송연
석사과정 (학석사연계)
- Low-melting point solder alloy
- Power module terminal bonding
- Ultrasonic bonding
임관수
석사과정 (학석사연계)
- Electronic Materials
- Electronic Packaging
정선주
학부연구생
- Electronic Materials
- Electronic Packaging
신지환
학부연구생
- Electronic Materials
- Electronic Packaging
김연빈
학부연구생
- Electronic Materials
- Electronic Packaging
김종유
학부연구생
- Electronic Materials
- Electronic Packaging
김민재
학부연구생