34. 첨단 반도체 패키징을 위한 미세 피치 Cu Pillar Bump 연구 동향 (Recent Advances in Fine Pitch Cu Pillar Bumps for Advanced Semiconductor Packaging), 마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 30 (3) (2023.9) 1-10
Eun-Chae Noh, Hyo-Won Lee, and Jeong-Won Yoon
33. Ni-foam/Sn-3.0Ag-0.5Cu 복합 솔더 소재를 이용한 EV 파워 모듈 패키지용 천이 액상 확산 접합 연구 (A Study of Transient Liquid Phase Bonding with Ni-foam/Sn-3.0Ag-0.5Cu Composite Solder for EV Power Module Package Application), 마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 30 (1) (2023.3) 55-62
Young-Jin Seo, Min-Haeng Heo, and Jeong-Won Yoon
32. 전기자동차용 Transient Liquid Phase Bonding 기술의 최신 연구 동향 (Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicle)”, 대한용접접합학회지(Journal of Welding and Joining), 40(3) (2022.6) 233-241
Dong-Hwan Lee, Min-Haeng Heo and Jeong-Won Yoon
31. 저융점 Sn-Bi 솔더의 신뢰성 개선 연구 (Improvement of Reliability of Low-melting Temperature Sn-Bi Solder)”, 마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 29 (2) (2022.6) 1-10
Min-Seong Jeong, Hyeon-Tae Kim, and Jeong-Won Yoon
30. Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste를 이용한 천이액상 확산 접합 연구 (A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste), 대한용접접합학회지(Journal of Welding and Joining), 39(4) (2021.8) 376-383
Jeong-Won Yoon, Dong-Hwan Lee and Byung-Suk Lee
29. 주석-니켈 마이크로 분말을 이용한 EV 전력모듈용 천이액상 소결 접합 (Transient Liquid Phase Sinter Bonding with Tin-Nickel Micro-sized Powders for EV Power Module Applications), 마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 28 (2) (2021.6) 71-79
Jeong-Won Yoon and So-Eun Jeong
28. 고전력 반도체 모듈 적용을 위한 마이크로 입자 구리 소결 접합부의 미세조직 및 기계적 강도에 미치는 소결 접합 조건의 영향 (Effect of sintering conditions on microstructure and mechanical strength of Cu micro-particle sintered joints for high-power semiconductor module applications),
대한용접접합학회지(Journal of Welding and Joining), 37(2) (2019.4) 26-34
Byung-Suk Lee, Jong-Hoon Back, and Jeong-Won Yoon
27. 전력변환모듈용 Cu terminal 초음파 접합부의 전단강도에 미치는 환경시험효과 (The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module),
대한용접접합학회지(Journal of Welding and Joining), 37(2) (2019.4) 1-6
Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, and Seung-Boo Jung
26. Sn-3.0Ag-0.5Cu 솔더 접합부의 계면반응과 취성파괴율에 미치는 Thin ENEPIG 도금두께의 영향 (Effect of thin ENEPIG plating thickness on interfacial reaction and brittle fracture rate of Sn-3.0Ag-0.5Cu solder joints), 대한용접접합학회지(Journal of Welding and Joining), 36(5) (2018.10) 52-60
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, and Jeong-Won Yoon
한국과학기술단체 총연합회 제29회 과학기술 우수논문상
25. 태양광 접속함 정션박스 모듈 적용을 위한 Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In 솔더링의 공정최적화 (Optimization of Soldering Process of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Alloys for Solar Combiner Junction Box Module),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 25(3) (2018.9) 13-19
Byung-Suk Lee, Chul-Min Oh, Hyun Kwak, Tae-Woo Kim, Heui-Bog Yun, Jeong-Won Yoon
24. 0.1 ㎛ Ni두께를 가지는 얇은 ENEPIG 층과 Sn-3.0Ag-0.5Cu 솔더와의 계면반응 및 접합강도 (Interfacial reactions and mechanical strength of SAC305/0.1㎛-Ni thin ENEPIG solder joints),
대한용접접합학회지(Journal of Welding and Joining), 35(6) (2017.12) 51-58
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, and Jeong-Won Yoon
23. 자동차 전력반도체 모듈 적용을 위한 Sb계 무연 솔더의 열화 특성 (Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module),
대한용접접합학회지(Journal of Welding and Joining), 35(5) (2017.10) 38-47
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, and Junghwan Bang
22. ENEPIG/Sn-Ag-Cu 솔더 접합부의 취성 파괴에 미치는 무전해 니켈 도금액의 영향 (Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint),
대한용접접합학회지(Journal of Welding and Joining), 35(3) (2017.6) 1-6
Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, and Sehoon Yoo
21. 미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성 (Solderability of thin ENEPIG plating layer for fine pitch package application),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 24(1) (2017.3) 83-90.
Jong-Hoon Back, Byung-Suk Lee, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
20. 자동차 전장용 무연솔더 및 솔더 접합부의 신뢰성 평가 (Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint),
대한용접접합학회지(Journal of Welding and Joining), 34(1) (2016.2) 26-34
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon and Chang-Woo Lee
19. 전기자동차용 고신뢰성 파워모듈 패키징 기술 (Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 21(4) (2014.12) 1-13
Jeong-Won Yoon, Jung-Hwan Bang, Yong-Ho Ko, Se-Hoon Yoo, Jun-Ki Kim, Chang-Woo Lee
18. LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향 (Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package),
대한금속ᆞ재료학회지 (Korean. J. Met. Mater.), 50(1) (2012) 71-77
Min-Kwan Ko, Jee-Hyuk Ahn, Young-Chul Lee, Kwang-Seok Kim, Jeong-Won Yoon, and Seung-Boo Jung
17. 솔더 접합부에 생성된 Void의 JEDEC 규격과 기계적 특성에 미치는 영향 (Analysis of Void Effects on Mechanical Property of BGA Solder Joint),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 18(4) (2011) 1-9
Jong-Gun Lee, Kwang-Seok Kim, Jeong-Won Yoon and Seung-Boo Jung
16. 열압착법을 이용한 경ㆍ연성 인쇄회로기판 접합부의 접합 강도에 미치는 접합 조건의 영향 (Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method), 마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 18(2) (2011) 63-67
Jong-Gun Lee, Min-Kwan Ko, Jong-Bum Lee, Bo-In Noh, Jeong-Won Yoon and Seung-Boo Jung
15. LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향 (Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package),
대한금속ᆞ재료학회지 (Kor. J. Met. Mater.), 48(11) (2010) 1035-1040
Young-Chul Lee, Kwang-Seok Kim, Ji-Hyuk Ahn, Jeong-Won Yoon, Min-Kwan Ko, and Seung-Boo Jung
14. Sn-Pb 솔더를 이용한 경연성 인쇄 회로 기판간의 열압착 본딩 (Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 17(3) (2010) 11-15
Jung-Hyun Choi, Jong-Gun Lee, Jeong-Won Yoon and Seung-Boo Jung
13. 전도성 접착제를 이용한 패키징 기술 (Recent Advances in Conductive Adhesives for Electronic Packaging Technology),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 16(2) (2009) 1-9
Jong-Woong Kim, Young-Chul Lee, Bo-In Noh, Jeong-Won Yoon and Seung-Boo Jung
12. Sn-3.5Ag BGA 패키지의 기계적ᆞ전기적 특성에 미치는 PCB표면처리 (Effect of Surface Finish on Mechanical and Electrical Properties of Sn-3.5Ag Ball Grid Array (BGA) Solder Joint with Multiple Reflow), 대한금속ᆞ재료학회지 (J. Kor. Inst. Met. & Mater.), 47(4) (2009) 261-266
Ji-Yoon Sung, Sung-Eun Pyo, Ja-Myeong Koo, Jeong-Won Yoon, Young-Eui Shin and Seung-Boo Jung
11. OSPᆞENIG 표면처리된 기판과 Sn-3.0Ag-0.5Cu 솔더 접합부의 낙하충격 신뢰성 평가 (Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 16(1) (2009) 33-38
Sang-Ok Ha, Sang-Su Ha, Jong-Bum Lee, Jeong-Won Yoon, Jai-Hyun Park, Yong-Chul Chu, Jun-Hee Lee, Sung-Jin Kim and Seung-Boo Jung
10. 리플로우 횟수가 ENIG/Sn-3.5Ag/ENIG BGA 솔더 조인트의 기계적, 전기적 특성에 미치는 영향 (Effect of Multiple Reflows on Mechanical and Electrical Properties of ENIG/Sn-3.5Ag/ENIG Ball Grid Array (BGA) Solder Joint,
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 16(1) (2009) 7-11
Ji-Yoon Sung, Sung-Eun Pyo, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Sung-Ho Won and Seung-Boo Jung
9. Optoelectronic 패키징을 위한 Au-Sn 플립칩 범핑 기술과 신뢰성 (Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging),
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 26(1) (2008.02) 37-43
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh and Seung-Boo Jung
8. 플립칩 패키징을 위한 초음파 접합 기술 (Ultrasonic Bonding Technology for Flip Chip Packaging),
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 26(1) (2008.02) 31-36
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon, Bo-In Noh, Chang-Yong Lee, Jeong-Hoon Moon, Choong-Don Yoo and Seung-Boo Jung
7. 전자 패키지의 전기적 특성평가 (Electrical characterization of electronic package),
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 26(1) (2008.02) 17-23
Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung
6. Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구 (Study on Wettability of Sn-Xwt%Cu Solder),
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 25(6) (2007.12) 632-637
Bo-In Noh, Jeong-Won Yoon, Bui Quoc Vu and Seung-Boo Jung
5. 전자 패키징의 플립칩 본딩 기술과 신뢰성 (Flip-chip Bonding Technology and Reliability of Electronic Packaging),
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 25(2) (2007.04) 108-117
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon and Seung-Boo Jung
4. BGA 패키지의 기계적ㆍ전기적 특성 평가 및 평가법 (Evaluation and Test Method Characterization for Mechanical and Electrical Properties in BGA Package),
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 12(4) (2005.12) 289-299
Ja-Myeong Koo, Jong-Woong Kim, Dae-Gon Kim, Jeong-Won Yoon, Chang-Yong Lee and Seung-Boo Jung
3. 전자 패키징의 요소기술 (Core Technology of Electronic Packaging),
대한용접학회지(Journal of the Korean Welding Society), 23(2) (2005.04) 22-29
Jeong-Won Yoon, Won-Chul Moon and Seung-Boo Jung
2. 무연 솔더 접합부의 신뢰성 평가 기술,
표면실장기술, (3) (2005) 18-27
Jeong-Won Yoon and Seung-Boo Jung
1. The Wetting Property of Sn-3.5Ag eutectic solder,
대한용접학회지(Journal of the Korean Welding Society), 20(1) (2002.02) 91-96
Jeong-Won Yoon, Chang-Bae Lee, Chang-Chae Shur and Seung-Boo Jung